Embedded Software / Firmware Engineer

se3
München

Embedded Software / Firmware Engineer

Own the low-level software layer of our autonomy platform across drones, payload and ground systems. Your work defines the fieldability, robustness and performance of our core product.


About SE3

SE3 Labs is building Spatial AI by combining 3D computer vision with large language models (LLMs). We believe the ability to reason about and act within physical space is foundational to unlocking the next generation of automation, from construction to smart infrastructure, and ultimately, defense.

Now, we’re building the physical platform to bring Spatial AI to life. That means high-performance, real-world robotic systems (starting with UAVs) and we’re looking for a skilled, hands-on embedded engineer who’s ready to power the foundation of these systems and have them communicate, update and perform reliably in the real world.


About the Role

As Embedded Software / Firmware Engineer, you’ll own the low-level software foundation across our embedded platforms - from bring-up and driver development to deployment tooling and in-field update infrastructure. You’ll work across diverse compute platforms, enabling new sensors, cameras, AI accelerators and networked peripherals and turning prototypes into robust, fieldable systems.

This is a hands-on, on-site role in our prototyping and test space, with optional travel for field trials and partner testing. You’ll work closely with our hardware design and testing teams while collaborating with our world-class AI software team to ship vertically integrated solutions fast. Your contributions will directly shape system architecture and hardware design, and the systems you support will move quickly from bench to real-world testing and front-line deployment at scale reshaping Europe's defense capability.

What You’ll Work On

  • Requirements & Bring-Up: Translate system needs into low-level software architecture and bring new boards and subsystems to life across Jetson, Arm and STM32 platforms

  • Drivers & Interfaces: Develop and maintain drivers and hardware-facing software for sensors, cameras, AI accelerators and communication networks

  • Kernel & System Layer: Work across embedded Linux, kernel and device-tree configuration, BSP-level integration and board bring-up to create stable, maintainable foundations

  • Flash, Boot & Deploy: Build and refine flashing, booting and serial deployment tooling for development, production, update and recovery workflows

  • Troubleshoot & Iterate: Debug on the bench, isolate failures fast, improve performance and stability, iterate until systems are ready for field use

  • Integrate & Maintain: Support system integration across aircraft platforms, work closely with hardware engineers and continuously improve performance, reliability and long-term maintainability

Your Profile

  • M.Sc. or higher in Computer Engineering, Electrical Engineering, Robotics, Embedded Systems or a related field

  • You bring 2+ years of hands-on experience in low-level software or firmware development for embedded systems; we’re equally interested and will reward more senior engineers who want to work deeply hands-on

  • You’re strong in C and Python and comfortable shipping real systems on embedded Linux in robotics, automotive or other hardware-adjacent environments

  • You have practical experience with hardware interfaces and protocols such as I2C , SPI , CAN , Ethernet and MIPI -based camera interfaces.

  • You’re comfortable with board bring-up, serial consoles, flashing workflows, boot issues, hardware-near debugging and systematic troubleshooting on real hardware

  • You know how to make software not just functional, but deployable, maintainable and robust under real-world conditions

  • You know how to validate low-level software on real hardware through structured debugging, integration testing and release-oriented validation .

  • Most importantly, you’re structured, fast-moving and mission-driven. You don’t wait for perfect specs but take ownership and iterate until it works

  • You thrive in a high-impact startup environment and are comfortable with a demanding execution pace, including sustained high intensity around critical milestones

Especially Valued Bonus Skills

  • Experience with secure boot , signed update systems, rollback and recovery strategies, or other security-critical deployment infrastructure

  • Yocto -based build systems, custom Linux image creation, and U-Boot

  • Experience with ROS and related robotics middleware is a plus

  • Camera bring-up and Linux media pipelines, including GStreamer

  • Experience integrating AI accelerators or other high-performance compute peripherals

  • Experience with UAVs, robotics, defense systems or other hardware that gets tested outside the lab

Perks & Benefits

  • Work Environment to Excel at: Find a high-quality and modern toolset, flat hierarchy and a skilled, driven team which will push the limits together with you

  • AI-boosted workplace: We empower every employee with best-in-class AI tools and agents, giving you unlimited access to the latest advancements and a true productivity edge

  • Real Ownership: Get early, real stock to participate directly in SE3’s growth

  • 31 Paid Days Off: 30 vacation days plus your birthday off

  • Well-being Access: Free membership to gyms, yoga, and wellness through EGYM Wellpass

  • Team Offsites: We go on 2 company retreats per year, our last ones were in Italy, Greece and Spain

  • Mentorship: Work closely with experienced engineers and get paired with a professional mentor to support your growth

Our Process

  1. Intro Call (20 min): Let’s get to know each other (conducted by Michael, our Chief of Staff)

  2. Technical Interview (45 min) : (with Siva, Computer Vision Engineer)

  3. Onsite Trial/Case (1.5 hrs): We’ll bring up and troubleshoot something together, just like on the job (together with our Hardware Team)

  4. Team Dinner/Lunch: See if it’s a culture fit on both sides (can be integrated into the Onsite to accommodate long journeys)

Veröffentlicht am 2026-08-24

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