RF Design Expert for the Development of Wireless Communication Interfaces of Chiplets

Fraunhofer-Gesellschaft
München

CAREER IN MICROTECHNOLOGY RESEARCH – BIG OPPORTUNITIES WITH SMALL STRUCTURES!
CHANGE STARTS WITH US.


Do you want to change the world through science? Then the Fraunhofer Institute for Electronic Microsystems and Solid State Technologies EMFT is the perfect place to start your career!

With around 190 highly qualified employees at our locations in Munich, Oberpfaffenhofen and Regensburg, we combine many years of experience with extensive expertise in microelectronics and microsystems technology. Our wide range of technologies spans from advanced semiconductor processes and MEMS technologies to innovative 3D integration and flexible electronics.

These nano and microtechnologies form the foundation of our diverse fields of expertise, which include sensor technology, circuit design, system solutions with AI, analysis and testing, as well as micropumps.

Through the close collaboration of our experts, not only groundbreaking innovations arise, but also synergies that enable Fraunhofer EMFT to effectively tackle the complex challenges of our time.

The RF Design group is focused on integrated circuits and systems in the mmWave and sub-THz range and has expertise in the design of functional interposers as well as passive structures and components for the heterogenous integration of chiplets. Our goal is to research and develop new solutions in the field of subTHz wireless communication and radar-based sensing with focus on its 2.5/3D integration for radio frequency applications. We will use these competences to develop and design a wireless communication interface for chiplet solutions, which will be integrated with state-of-the-art technologies for heterogenous integration. This will be the base for realizing an innovative solution, which makes a robust and high-throughput communication for non-planar and moving devices possible.

Be part of change

  • Development and Optimization of integrated RF circuits and systems in mmWave and SubTHz range for wireless communication interfaces in chiplets
  • Design of passive RF components and 3D structures for the Integration of a wireless communication interface into a Chiplet.
  • Design of high-speed control circuits and data links for integrating wireless communication interfaces into complex, highly heterogeneous integrated systems.
  • Work closely with internal technology departments for heterogeneous integration and external partners at a high scientific level
  • Support our business activities with our industry customers with your technical expertise
  • Represent our institute and our department at scientific conferences and project meetings present achieved results at events and seek professional exchange
  • Engage in technical discussions with other experts and develop new ideas
  • Publish results in high-level scientific publications and reports

What you contribute

  • A successfully completed Doctoral's or master’s degree in electrical engineering, communications engineering, semiconductor technologies or similar.
  • Excellent knowledge of high-frequency technology and electromagnetic field theory
  • 5+ years’ experience in 2.5/3D electromagnetic simulations and RF circuit design
  • Advanced proficiency in the utilization of complex RF measurement techniques
  • Ideally experience in antenna design as well as design of passive RF devices and structures
  • High motivation and ability to quickly familiarize with new challenges
  • Enjoy working in a team to achieve high-quality results
  • Independent and structured approach to work with a good eye for the big picture and excellent problem-solving skills
  • Very good communication skills in German and English

What we offer

  • A challenging and varied job with meaning and responsibility - You work with the best minds in RF design and help shape the future of Europe as an innovation centre!
  • With us, you have room for commitment and creativity - you can set your own priorities and realize your ideas in the team and in projects.
  • Collaboration in an interdisciplinary and international team and integration into a large scientific network
  • Individual and extensive training opportunities and career boosters for your professional and personal development, e.g. opportunities for a doctorate or participation in the Fraunhofer Women's promotion program TALENTA
  • Work-life balance through flexible working time models, co-working office, mobile working and many other offers
  • Good transport connections and a discounted job ticket

The weekly working time is 39 hours. This position is also available on a part-time basis. We value and promote the diversity of our employees' skills and therefore welcome all applications – regardless of age, gender, nationality, ethnic and social origin, religion, ideology, disability, sexual orientation and identity. Severely disabled persons are given preference in the event of equal suitability. Our tasks are diverse and adaptable – for applicants with disabilities, we work together to find solutions that best promote their abilities. Appointment, remuneration and social security benefits based on the public-sector collective wage agreement (TVöD). Additionally Fraunhofer may grant performance-based variable remuneration components.

With its focus on developing key technologies that are vital for the future and enabling the commercial utilization of this work by business and industry, Fraunhofer plays a central role in the innovation process. As a pioneer and catalyst for groundbreaking developments and scientific excellence, Fraunhofer helps shape society now and in the future.

Ready for a change? Then apply now and make a difference! Once we have received your online application, you will receive an automatic confirmation of receipt. We will then get back to you as soon as possible and let you know what happens next.

Fraunhofer Institute for Electronic Microsystems and Solid State Technologies EMFT

Requisition Number: 84549Application Deadline: 06/30/2026

Veröffentlicht am 2026-06-30

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